Multiphysics simulation is emerging as an important tool to optimize industrial processes and reduce engineering costs. This was explained by Bertil Nistad, Technology Manager at COMSOL, during his participation at AMPP 2026.
COMSOL’s presence at the AMPP Annual Conference + Expo 2026 has generated notable interest among attendees. According to Bertil Nistad, the company’s Technology Manager, the booth has seen a steady flow of visitors, including both current users and professionals interested in getting started with simulation tools.
In addition, this interest reflects a clear trend within the industrial sector: more and more companies are looking for solutions that allow them to anticipate how their systems will behave without resorting to costly physical processes. In this context, multiphysics simulation is gaining prominence as a technology capable of delivering value from the earliest stages of development.
COMSOL has focused its offering on the development of mathematical modeling software that makes it possible to simulate multiple physical phenomena simultaneously. Its platform, COMSOL Multiphysics®, is used in fields such as engineering, manufacturing, and scientific research to analyze complex systems with greater accuracy.
In this sense, multiphysics simulation makes it possible to integrate variables such as thermal, electromagnetic, and mechanical effects within a single model. This capability provides a more realistic view of how systems behave under real-world conditions, which is essential for engineers.
Likewise, this interdisciplinary approach facilitates technical decision-making. By considering multiple physical interactions simultaneously, professionals can anticipate problems, refine designs, and optimize product performance before manufacturing.
As for its impact on industry, one of the main benefits of multiphysics simulation is the reduction of costs associated with physical prototyping. Traditionally, companies had to build multiple prototypes to validate their designs, which required a significant investment of time and resources.
However, using simulation tools makes it possible to create virtual prototypes capable of replicating a system’s behavior across different scenarios. This reduces the need for physical testing and speeds up the development process.
In this way, organizations can shorten time to market and improve competitiveness. At the same time, errors in later project phases are minimized, resulting in greater operational efficiency.
Technological evolution is also shaping the future of multiphysics simulation. During the interview, Nistad highlighted the role of digital twins as one of the most relevant applications in this field. These virtual models make it possible to replicate real systems and analyze their behavior over time.
In addition, the integration of neural networks opens up new possibilities in terms of speed and analytical capability. These techniques make it possible to obtain faster results and optimize simulation processes, especially in environments where multiple variables must be evaluated in a short time.
As a result, combining multiphysics simulation with artificial intelligence is shaping a new landscape for advanced engineering. Companies can access more accurate and efficient tools for decision-making.
The growing complexity of industrial systems and the high cost of physical prototyping are driving the adoption of simulation-based solutions. As Bertil Nistad notes, these tools will become increasingly relevant in the development of products and processes.
In this context, multiphysics simulation is becoming an essential resource for engineers and researchers. Its ability to predict the behavior of complex systems and optimize designs places it at the heart of the industrial sector’s digital transformation.
Thus, events like AMPP 2026 highlight the market’s interest in technologies that improve efficiency and reduce risk. COMSOL, with its focus on mathematical modeling and advanced simulation, continues to position itself as a relevant player in this field.
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Source: Inspenet.
